Search
Now showing items 1-1 of 1
Parâmetros térmicos de solidificação, microestrutura e resistência mecânica de ligas eutéticas Sn-0,7%Cu-(xNi)
(Universidade Federal de São Carlos, 2013-07-29)
Sn-Pb traditional solder alloys were overly utilize in electronic devices industry, since their properties and features use were adequate and well known. In the last years many restrictions and directives were and have ...